Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...

Huntsman Advanced Materials (Basel, Switzerland) reports that it has developed a new epoxy resin system and a novel and cost-efficient compression molding concept. By combining a new fast-cure ...

At the upcoming Fakuma show in Germany, Netstal will present what company officials are calling a world's first: injection-compression molding on stack molds. Fakuma is set for Oct. 13-17 in ...

In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a ...

Sacmi Imola S.C.'s Closures and Containers Division will demonstrate its compression blow forming (CBF) technology at NPE2018 in Booth W363. CBF combines elements of compression molding and blow ...

PLYMOUTH, MN - July 07, 2026 - PRESSADVANTAGE - Implantable silicone foam components can support niche medical device ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...