Gold-on-gold stud-bumps comprise a connection technique used in some microminiature flip-chip assemblies: (a) shows bumps on an IC; (b) is a close-up view. Flip-chip processes allow miniaturization of ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Dec. 4, 2002 – Matrics, a startup in Columbus, Md., revealed that it is producing a low-cost UHF chip based on the Auto-ID Center specification known as Class 0. The company is also working with KSW ...