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Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
The patent was filed 18 months ago, and there's no further indication of ongoing development ...
Intel Corp. has unveiled a new transistor dielectric material that it says will boost performance and dramatically reduce current leakage in next-generation chips. The advancement could enable Intel ...
At this week's HotChips 34 conference, Intel CEO Pat Gelsinger laid out his company's vision for the future, and a cornerstone of that vision is advanced packaging combining multiple chiplets. That's ...
tom's Hardware on MSN
Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...
Intel has talked a lot about the density of its 14-nanometer chip manufacturing technology relative to competing technologies from rivals Samsung and TSMC . In particular, Intel will tell you that its ...
Montecito exceeds the billion-transistor count because the Itanium-2 processor architecture is itself complex — a 64-bit processor intended for server applications — and the Montecito model ...
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