Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

At SNEC 2026 in Shanghai, GCL System Integration (GCL SI) presented a broader view of its next-generation module strategy, ...

Ultra-wide bandgap semiconductors exhibit advantageous electronic properties that make them promising for high-voltage, high-power electronics applications. Building on over a decade of progress in ...

Adoption of silicon carbide (SiC) is becoming more widespread among electric-vehicle (EV) systems such as dc-dc converters, traction inverters, and on-board chargers (OBCs) with bidirectional ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

This four-year outdoor field test report authoritatively confirms the comprehensive power generation advantages of N-type TOPCon modules over BC modules. Thanks to their outstanding bifacial power ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).