Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...
The QSiC Dual3 family of 1,200-V half-bridge MOSFET modules developed by SemiQ Inc. targets motor drives in data center cooling systems, grid converters in energy storage systems, and industrial ...
SemiQ continues to expand its Gen3 QSiC MOSFET portfolio with 1200-V power modules offering high current density and low thermal resistance. The new seven-device lineup includes high-current S3 ...
KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global ...
Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet the stringent High Humidity High Voltage High Temperature Reverse Bias ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Microchip Technology has announced the availability of its new 3.3 kV HV-D3 mSiC power modules, aimed at simplifying the adoption of solid-state transformers (SSTs) in artificial intelligence (AI) ...
UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...
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