The QSiC Dual3 family of 1,200-V half-bridge MOSFET modules developed by SemiQ Inc. targets motor drives in data center cooling systems, grid converters in energy storage systems, and industrial ...

Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...

The third-generation series of QSiC MOSFET modules from SemiQ Inc. offer current capabilities of up to 608 A and a junction-to-case thermal resistance of just 0.07ºC/W to address the growing demand ...

KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global ...

SemiQ continues to expand its Gen3 QSiC MOSFET portfolio with 1200-V power modules offering high current density and low thermal resistance. The new seven-device lineup includes high-current S3 ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

The HV‑D3 mSiC Power Modules integrate 3.3 kV SiC MOSFETs and Schottky diodes within an industry-standard 62 mm package. The design is intended to improve power delivery efficiency by enabling direct ...

Microchip Technology has announced the availability of its new 3.3 kV HV-D3 mSiC power modules, aimed at simplifying the adoption of solid-state transformers (SSTs) in artificial intelligence (AI) ...

The need to mitigate climate change is driving a need to electrify our infrastructure, vehicles, and appliances, which can then be charged and powered by renewable energy sources. The most visible and ...

Rather than treating wireless road charging as a futuristic curiosity, Infineon and Electreon are now framing it as infrastructure that can rival the power levels of today’s top DC fast chargers. By ...