Semiconductor Engineering

Need For KGD Drives Singulated Die Screening

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
Silicon Semiconductor

Closing the gap: How intelligent sensing is reshaping wafer process control

Here, Vidya Vijay, Director of Business Development at Nordson Test and Inspection, examines how intelligent in-situ sensing ...
Semiconductor Engineering

Using Test And Metrology Data For Dynamic Process Control

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Business Wire

Hprobe Announces New Generation of Magnetic Test Head for Wafer Sort of MRAM in Mass Production

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
Digi Times

ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
EDN

Contactless Testing Wafer Testing

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world’s first semiconductor wafer whose ...