Having Linux on so many devices is both a blessing and a curse. Sure, it is great that you can hack on things and modify them ...
Abstract: Aiming to solve high parasitic inductance, uneven thermal stress, and excessive junction temperature of power module, a novel 3D stacked packaging architecture incorporating a direct plated ...
Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This ...
The aim of this project is to provide functionality to load COLLADA files into Java for rendering, specifically using OpenGL. The algorithms within are written for this transformation, since not all ...
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